Application of Printed Circuit Board Interconnection Technology
1. Traditional through-hole plating
The most common and inexpensive interlayer interconnection technology is the traditional through-hole plating technology.
In this technology, all boreholes are drilled through the panel, regardless of whether they are used as component holes or as through holes.
The main disadvantage of this technology is that through holes occupy precious space of all layers, regardless of the need for electrical connections in this layer.
2. Buried hole
Buried holes are plated through holes connecting two or more layers of multiple substrates. Buried holes are located in the inner structure of the circuit board and do not appear on the external surface of the circuit board.
Compared with traditional plating through-hole structure, buried hole saves a lot of space. When the signal line density is very high, more holes are needed to connect the signal layer and more signal routes are needed, buried hole technology can be used. However, because buried hole technology requires more procedures, the advantage of line density is to increase the cost of circuit boards.
3. Blind hole
Blind holes are plated through holes that connect the surface of multiple substrates to one or more layers, and they do not pass through the entire thickness of the plate.
Blind holes can be used on both sides of the multi-substrate. Blind holes can connect through holes and through components holes of the circuit board. Blind holes can stack each other on the board and can be made smaller, thus providing more space or laying more signal lines.
Blind hole technology is particularly useful for SMD and connectors because they do not require large component holes and require only small holes to connect the outer surface to the inner layer. On very dense and thick multi-substrate, surface mounting technology can reduce weight and provide sufficient design space for designers.
