The true PCB was born in the 1930s. It was made by electronic printing. The insulating board was cut into a certain size. At least one conductive pattern was attached to the PCB, and there were holes (such as component holes, fastening holes, metallized holes, etc.).
The chassis is used to replace the chassis of the electronic components of the former device, and to realize the interconnection between the electronic components, so as to play the role of relay transmission.
PCB is the support of electronic components, known as the "mother of electronic products".
PCB Development History in the world
In 1936, Paul Eisler, the Austrian inventor of printed circuit boards, first used printed circuit boards in radio installations.
In 1943, Americans applied the technology to military radios.
In 1947, NASA and ASB launched the first PCB technical seminar.
In 1948, the United States officially recognized the invention and used it for commercial purposes.
In the early 1950s, because the bonding strength and weld resistance of CCL copper foil and laminates were solved, the performance was stable and reliable, and large-scale industrial production was realized. Copper foil etching became the mainstream of PCB manufacturing technology, and single panel production began.
In the 1960s, porous metallized double-sided PCB was produced on a large scale.
In the 1970s, multi-layer PCB developed rapidly, and continuously developed to the direction of high precision, high density, fine line and small hole, high reliability, low cost and automation continuous production.
In the 1980s, surface mounted printed boards (SMT) gradually replaced plug-in PCB and became the mainstream of production.
Since the 1990s, surface mounting has developed from flat package (QFP) to spherical array package (BGA).
Since the 21st century, high-density BGA, chip-level packaging and multi-chip module PCB based on organic laminate materials have developed rapidly.
Development History of PCB in China
In 1956, China began to develop PCB.
In the 1960s, single-sided PCB was produced in batches, double-sided PCB was produced in small batches and multi-layer PCB was developed.
In the 1970s, due to the limitation of historical conditions at that time, the development of PCB technology was slow, which made the whole production technology lag behind the advanced level of foreign countries.
In the 1980s, advanced single-sided, double-sided and multi-layer PCB production lines were introduced from abroad, which improved the production technology of PCB in China.
In the 1990s, foreign PCB manufacturers such as Hong Kong, Taiwan and Japan came to China to set up joint ventures and wholly-owned factories, which made the output and technology of PCB in our country advance by leaps and bounds.
In 2002, it became the third largest PCB producer.
In 2003, PCB output and import and export exceeded $6 billion, surpassing the United States for the first time and becoming the second largest PCB producer in the world. The proportion of PCB output increased from 8.54% in 2000 to 15.30%, nearly doubling.
In 2006, China has replaced Japan as the world's largest PCB production base and the country with the most active technological development.
In recent years, China's PCB industry has maintained a high growth rate of about 20%, far higher than the growth rate of the global PCB industry. From 2008 to 2016, the output value of China's PCB industry increased from 15.037 billion US dollars to 27.123 billion US dollars, with a compound annual growth rate of 7.65%, much higher than the global composite growth rate of 1.47%. In 2018, China's PCB output value reached 33.6 billion US dollars, an increase of 10.16% compared with the same period last year.
