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Selection of PCB Substrate Material

2019 08/07

Selection of PCB Substrate Material


1. Gold-plated sheet


The cost of gold plated sheet is the highest among all sheets, but it is the most stable and suitable for lead-free process, especially in some high unit price or electronic products requiring high reliability.

2. OSP board


OSP process has the lowest cost and is easy to operate, but its popularity is still poor due to the need for the assembly plant to modify equipment and process conditions and poor rework.
With this kind of plate, after high temperature heating, the protective film on PAD will be destroyed, which will lead to the decrease of solderability. Especially when the substrate is subjected to secondary soldering, the situation becomes more serious. Therefore, if the DIP process is needed again, the DIP end will face the challenge of welding.

3. Immersion Ag


Although "silver" itself has strong migration, which leads to leakage, the current "silver dipping" is not pure silver metal in the past, but organic silver co-plated with organic matter, so it has been able to meet the needs of lead-free process in the future, and its solderability life is longer than OSP plate.

4. Gold plate


The biggest problem of this kind of substrate is the problem of "black pad", so many large factories do not agree to use this process in lead-free process, but most domestic manufacturers use this process.

5. Tin plate


This kind of substrate is easy to be contaminated and scratched, and the process (FLUX) will become oxidized and pornographic. Most domestic manufacturers do not use this process, and the cost is relatively high.

6. tinplate


Because cost is low, solder is good, reliability is good, compatibility is strongest, but this kind of solder spraying board with good soldering characteristics can not be used in lead-free process because it contains lead.


In addition, "tin-silver-copper spraying tin plate" is difficult to obtain characteristic data because most of them do not use this process.

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