Focusing on 5G millimeter wave, Apple Mobile Flexible Circuit Board Supplier Involved in AiP Antenna
According to Taiwan media, Taijun Technologies, the main supplier of Apple's FPC (Flexible Circuit Board), is seeking innovative transformation of high-frequency antenna modules due to declining demand for new smartphones with a capacity utilization rate of only 50%.
At present, 5G mobile phones will be sold in large quantities and 5G high-frequency transmission will change the shape of smart terminal antenna. Taijun is launching diversified innovative transformation, focusing on 5G new materials, multi-layer board and antenna module integration technology at the technical level.
Taijun has used DuPont's MPI material to produce antenna flexible board since last year. Its high-frequency antenna's technical ability has been recognized. This year, it has obtained many customers'certification of LCP new material technology and antenna module integration scheme. In the field of MPI and LCP high frequency antenna module, Taijun has accumulated a lot of strength.
In response to the business challenges that may arise from the change of 5G terminal antenna in the millimeter wave stage, Taijun has taken a number of initiatives to strengthen the industrial layout, including the establishment of a 5G millimeter wave base in Kaohsiung:
Taijun Expansion 5G Business Layout:
1. Invest a lot of money in establishing 5G millimeter wave base in Kaohsiung
2. Work with Professor Weng Jinkui, a communications expert, to attract more local wireless communication talents to join us.
3. It has been reported that Japan's technical team has joined, but it has not been officially confirmed at present.
According to the dynamic information of Qualcomm, Samsung, Huawei, Sunlight and other manufacturers, the powerful players in the mobile phone industry chain have invested a lot of money and manpower in the AIP (Antenna-in-Package) encapsulation antenna. Qualcomm led the release of the world's first 5G millimeter wave AiP antenna module QTM052 for fashionable smartphones in July 2018.
According to Professor Zhang Yueping, an expert in the National Thousand People Program and IEEE Fellow, there is no doubt that the AiP encapsulated antenna will be the mainstream solution for 5G millimeter wave applications. The antenna configuration and industrial layout of smart terminals will undergo significant changes in the 5G millimeter wave stage.
As it happens, LCP is one of the key dielectric materials of AiP encapsulated antenna. LCP has good dielectric properties, nominal dielectric constant is 2.9, tangent loss angle is 0.003. It is very suitable for designing encapsulated antenna. Taijun has the opportunity to enter into the AIP packaging antenna manufacturing business through technical accumulation in the field of LCP high frequency antenna, understanding of LCP antenna and good cooperation with material suppliers.
Packaged antenna (AiP) is a technology that integrates antenna and chip in package to realize system-level wireless function based on packaging material and technology. In addition to using advanced packaging technology (such as cladding, silicon perforation, system-level packaging, etc.), AiP also needs to use LCP material in the internal layer as FPCB board (flexible printed circuit board) to reduce signal interference, reduce path loss and enhance signal transmission capability.
AiP Structure Diagram (Source: Tuoqi Industrial Research Institute)
Taijun Technologies is Taiwan's first listed professional flexible circuit board manufacturing service company. Its products include flexible printed circuit board (FPC) and flexible board module (FPCA), which are mainly used in smart phones, tablets and wearable devices. The group's operating base covers Kaohsiung, Taoyuan, Kunshan, Xiamen and the United States Branch (FIA), and its main customers include large EMS factories and well-known brand companies in Japan, Europe and the United States.
Taijun Technologies ranks among the top 10 manufacturers of flexible circuit boards in the world. Taijun Technologies is a member of Apple's supply chain.
