Advantages and Main Applications of FPC Flexible Circuit Board
Flexible circuit boards are designed to improve space utilization and product design flexibility. They can meet the design needs of smaller and higher density installations, and also help to reduce PCB assembly processes and enhance reliability. It is the only solution to meet the requirements of miniaturization and mobility of electronic products.
Flexible circuit boards etch copper circuits on polymer substrates or print polymer thick film circuits. For thin, light, compact and complex devices, the design solutions include from one-sided conductive circuits to complex multi-layer three-dimensional packaging.
The total mass and volume of flexible package is 70% less than that of traditional wire harness method. Flexible circuit boards can also increase their strength by using reinforcing materials or liners to achieve additional mechanical stability.
Flexible circuit boards can move, bend and twist without damaging wires. They can have different shapes and special package sizes. The only limitation is the volume space problem. Because it can withstand millions of dynamic bends, flexible circuit boards can be well suited to continuous or periodic motion of the internal connection system, as part of the final product function. Some products requiring the movement of electrical signal/power supply and smaller shape factor/package size benefit from flexible circuit boards.
Flexible circuit boards provide excellent electrical performance. Low dielectric permittivity allows rapid transmission of electrical signals; good thermal performance makes the module easy to cool down; high glass transition temperature or melting point makes the module work well at higher temperatures.
Flexible circuit boards can provide higher assembly reliability and output by reducing the hardware required for internal connection, such as solder joints, trunks, backplane lines and cables commonly used in traditional electronic packaging. Because the traditional internal hardware consisting of complex multi-system is prone to high component dislocation rate when it is assembled. With the advent of quality engineering, a thin flexible system is designed to be assembled in only one way, thus eliminating human errors usually associated with independent wiring engineering.
